PC board blister processing process

PC board blister processing process at any time PC board using the expanding field gradually by the vast user attention, we discuss PC board blister processing in the PC board drilling process, which is also PC board in the building materials, machinery industry in the field of customers often asked a question.

PC blister board drilling in its use will often encounter, standard high-speed steel twist drill or with a wedge-shaped drill with a point of view can be used for PC board processing drilling. The drilling method changes slightly when drilling larger holes and thin panels. One of the carbide drills is better, as it has a very sharp cutting edge. The more important element to consider when drilling PC blister boards is the heat that occurs in the practical drilling. In order to drill a bright and stress-free hole, the amount of heat generated should be as low as possible. If the following criteria are adhered to, it will be easy to drill a bright and stress-free hole. The hole should be handled at all times to avoid excessive frictional heat from the build-up of debris; the drill should always be lifted from the hole and cooled with compressed air; the plate or perhaps the product must be clamped to reduce vibration and to ensure the accuracy of the drilled scale; the distance between the hole and the edge of the plate should not be less than 1 to 1.51 times the diameter of the hole; the hole must be larger than the bolt, screw or other fixed part to allow for thermal expansion and contraction Allowances should be made for thermal expansion and contraction; for high volume production, carbide drills are recommended. The drilling must leave a gap for expansion, the size of the gap depends on the scale of the plate and the scale of temperature fluctuations during the preheating period, large plates even need to drill oval holes, the centre of the hole to the edge of the plate must be at least 2 times the diameter of the hole, and the smaller should also be 6mm. screw tightness is limited to the extent that it can make the PC blister plate under the temperature stress of free expansion or shortening.

Industrial taps can be used for tapping PC panels, but due to the notch effect there is a risk of cracking and it is advisable to select this method only as a last resort if no other connection method is available, e.g. gluing. Under no circumstances should PC blister boards be exposed to cutting oil. Tapped metal inserts can be embedded in the PC sheet and can be ultrasonically welded.